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Fabrication and process requirements of the three fhase EI lamination
Jan 21, 2019

The 3 fhase EI lamination is effective in the process of manufacturing, including chip design, wafer fabrication, package fabrication, and testing. The wafer fabrication process is particularly complicated. The first is the chip design, the "pattern" generated according to the design requirements.

The composition of the wafer of the 3 fhase EI lamination is silicon, the silicon is refined by quartz sand, the wafer is purified by silicon (99.999%), and then the pure silicon is made into a silicon crystal rod, which becomes a manufacturing integration. The material of the quartz semiconductor of the circuit is sliced to the specific wafer required for the chip fabrication. The thinner the wafer, the lower the cost of production, but the higher the process requirements.

The 3 fhase EI lamination is first coated with a layer of photoresist on the surface of the wafer (or substrate) and dried. The dried wafer is transferred to the lithography machine. The light is projected onto the photoresist on the surface of the wafer through a mask to achieve exposure and stimulate photochemical reaction. The second baking of the exposed wafer, the so-called post-exposure baking, is more complete than the photochemical reaction.

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